ADVERTISEMENT
 
 

Related Categories:

Clean Plast CP-H Purge Compound

Available from Clean Plast Purge Compounds

Clean Plast CP-H Purge Compound
Clean Plast™ CP-H and H-EC are a Ready To Use purge in a precise blend of Clean Plast™ Highly Concentrated Active and a neutral carrier resin. Clean Plast™ will not leave any Purge contamination and...Read More
Clean Plast™ CP-H and H-EC are a Ready To Use purge in a precise blend of Clean Plast™ Highly Concentrated Active and a neutral carrier resin. Clean Plast™ will not leave any Purge contamination and since the particle size is 0.1 mm it is safe to mold through the smallest valve gates. There are no abrasives in Clean Plast™ CP-H and H-EC purge products. CLEAN PLAST™ CP-H and H-EC processing temperature range from 374º F to 608º F (190º C to 320º C). It removes, at the temperature of the previously processed material any hang ups and deposits. Great for Lenses, PA, PC, ABS, SAN, PMMA, and other high temperature resins.

More Products from Clean Plast Purge Compounds

Available from: Clean Plast Purge Compounds
Clean Plast purging compounds are specifically designed for all plastic resins and all plastic processes. Clean Plast purge products perform so well that Clean Plast purge compounds will be the only...Read More

Related Research You May Be Interested In

Advances in Lenticular Lens Arrays for Visual Display & Cylinder Engraving Techniques
During the past decade, products incorporating lenticular materials have grown rapidly and continue to do so. The lenticular technology research reported in this paper...Read More
By: Jacobsen Lenticular Tool & Cylinder Engraving Technologies (JacoTech) | Published: 9/1/2010
ADVERTISEMENT